Copper , sputtering target, diam. x thickness 2.00 in. x 0.25 in., 99.95% trace metals basis

Code: 767476-1EA D2-231

Application

Sputtering is a process whereby atoms are ejected from a solid target material due to bombardment of the target by energetic particles. The extreme miniaturizatio...


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Application

Sputtering is a process whereby atoms are ejected from a solid target material due to bombardment of the target by energetic particles. The extreme miniaturization of components in the semiconductor and electronics industry requires high purity sputtering targets for thin film deposition.

Packaging

1 ea in rigid mailer

assay99.95% trace metals basis
bp2567 °C (lit.)
density8.94 g/mL at 25 °C (lit.)
diam. × thickness2.00 in. × 0.25 in.
formturnings
InChI keyRYGMFSIKBFXOCR-UHFFFAOYSA-N
InChI1S/Cu
mp1083.4 °C (lit.)
Quality Level100
reaction suitabilitycore: copper
resistivity1.673 µΩ-cm, 20°C
SMILES string[Cu]
Cas Number7440-50-8
This product has met the following criteria: