Zinc , sputtering target, diam. x thickness 3.00 in. x 0.125 in., 99.995% trace metals basis

Code: 749060-1EA D2-231

Application

Sputtering is a process whereby atoms are ejected from a solid target material due to bombardment of the target by energetic particles. It is commonly used for th...


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Application

Sputtering is a process whereby atoms are ejected from a solid target material due to bombardment of the target by energetic particles. It is commonly used for thin-film deposition, etching and analytical techniques.

Packaging

1 ea in rigid mailer

assay99.995% trace metals basis
bp907 °C (lit.)
density7.133 g/mL at 25 °C (lit.)
diam. × thickness3.00 in. × 0.125 in.
formsolid
InChI keyHCHKCACWOHOZIP-UHFFFAOYSA-N
InChI1S/Zn
mp420 °C (lit.)
resistivity5.8 µΩ-cm, 20°C
SMILES string[Zn]
vapor pressure1 mmHg ( 487 °C)
Cas Number7440-66-6
This product has met the following criteria: