Aluminum , sputtering target, diam. x thickness 3.00 in. x 0.125 in., 99.9995% trace metals basis

Code: 749036-1EA D2-231

Application

Sputtering is a process whereby atoms are ejected from a solid target material due to bombardment of the target by energetic particles. It is commonly used for th...


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Application

Sputtering is a process whereby atoms are ejected from a solid target material due to bombardment of the target by energetic particles. It is commonly used for thin-film deposition, etching and analytical techniques.

Packaging

1 ea in rigid mailer

assay99.9995% trace metals basis
autoignition temp.1400 °F
bp2460 °C (lit.)
density2.7 g/mL at 25 °C (lit.)
diam. × thickness3.00 in. × 0.125 in.
formpellets
InChI keyXAGFODPZIPBFFR-UHFFFAOYSA-N
InChI1S/Al
mp660.37 °C (lit.)
reaction suitabilitycore: aluminum
resistivity2.6548 µΩ-cm
SMILES string[Al]
Cas Number7429-90-5
This product has met the following criteria: