Application

Epoxy curative with good thermal properties. Stable Low viscosity Does not impede free radical cure Thermoset adhesives Curative for epoxy/(meth) acrylate hybrids Hybrid epoxy/free radical thermosets

BPF is a resin that can be used in the development of high strength materials in aircrafts and electronic products. It can form a variety of engineering plastics for industrial applications.

General description

Bisphenol F (BPF) is an epoxy based resin that can be used as an engineering polymer. It has a low viscosity, high thermal stability and chemical resistance. It can be used in anticorrosive coatings and epoxy based adhesives. It can be cured by using amine and anhydride based hardeners. It has an epoxy value of 0.549 mol/100g.

Packaging

25 g in glass bottle