Application

For use at room temperature or elevated temperature. Etches cleanly, eliminating need for an intermediate rinse.

Nichrome etchant is used in the fabrication of microheater patterns of polydimethyl siloxane (PDMS), silica (SiO₂) and glass substrates, which can be further used in the fabrication of flow sensors. It may also be used to etch out nickel (Ni) from the electroplated Ni on amorphous silica wafers.

Ceric ammonium nitrate-based etchant. Etches Al, Cr, Cu, Ni, GaAs. Surface oxidizes Si, Ta/TaN. Etch rate of 50 Å/sec @ 40 °C. Etches cleanly with only a deionized water rinse needed.

Features and Benefits

Designed for etching nichrome thin films used in microelectronic applications. Compatible with both positive and negative photoresists and provides fine-line control with minimal undercutting. Filtered to 0.2 micron to remove particlulates and composed of semiconductor grade materials.

General description

Nichrome etchant is a high purity etching system that is a mixture of ceric ammonium nitrate and nitric acid. It can be used to etch the nickel and chromium alloy.

Packaging

500 mL in poly bottle