Application

SiO₂ is majorly used as a substrate material with excellent thermo-mechanical properties in a variety of applications which include:vapour depositionphase depositionatomic force microscopy probes(AFM)spin coatingelectronic based devices

Features and Benefits

An excellent substrate for microwave filters for applications in the wireless communication arena.

Other Notes

specific heat = 0.18 cal/g; thermoelectric constant = 1200µV/°C @ 300 °C; thermal conductivity = 0.0033 cal/cm°C; themal expansion (x10^-6) = α₁₁: 13.71, α₃₃: 7.48; Q value = 1.8 × 10⁶ min; acoustic velocity, SAW = 3160 m/sec; frequency constant, BAW = 1661 kHz/mm; piezoelectric coupling = K² BAW: 0.65%, SAW: 0.14%

Packaging

5 ea in padded box

Physical form

Crystalline, hexagonal (a = 4.914 Å, c = 5.405 Å)